Manufacturing method for display device, display device, manufacturing method for electronic apparatus, and electronic apparatus

ABSTRACT

A bank section ( 112   a,    112   b ) are formed between a plurality of electrodes ( 111 ) which are formed on the base body ( 2 ). A functional layer is formed on each electrode ( 111 ) by injecting a composition from a plurality of nozzles. A display device is manufactured which is provided bank sections ( 112   a,    112   b ) between the functional layers formed on the electrode ( 111 ). A nozzle array in which a plurality of nozzles are disposed to be inclined in a main scanning direction scans on the base body ( 2 ). A liquid drop ( 110   c   1 ) of the composition which is injected initially for each functional layer is injected so as to contact at least a part of the bank sections ( 112   a,    112   b ). According to manufacturing method for a display device in the present invention, it is possible to realize a display device having superior display quality without causing non-uniform functional layer for each pixel electrode.

TECHNICAL FIELD

The present invention relates to manufacturing method for a displaydevice, a display device, manufacturing method for an electronicapparatus, and an electronic apparatus.

BACKGROUND ART

In recent years, a color display device in which a functional layer madefrom a functional member is sandwiched between a pair of electrodes and,in particular, an organic electro-luminescence (hereinafter called EL)display device using a functional member such as an organic illuminatingmember are developed by employing a patterning method for the functionalmember in an ink jet method in which the functional member such asorganic fluorescence member is liquefied so as to be injected on a basemember.

In the patterning method for the functional member explained above, abank section is formed around a pixel electrode made from, for example,ITO formed on a base body, and next, the pixel electrode and a part ofthe bank section neighboring the pixel electrode are processedlyophilically and the rest of the bank section is processed to be madevolatile, consequently, a composition which includes members containedin the functional layer is injected in approximately center of the pixelelectrode so as to be dried; thus, the functional layer is formed on thepixel electrode.

In such a conventional method, if the injected composition overflowsfrom the bank section, it does not occur that the injected compositionis repelled at a region in the bank section which is processed to bewater-repellant and flows on the other neighboring pixel electrodes;thus, it is possible to performing a patterning operation accurately.

However, in the conventional method, the composition which is injectedspreads from a center of the pixel electrode toward a peripherytherearound uniformly; thus, the injected composition hardly spreads toa part of the bank section which is processed to be lyophilic.Therefore, there is a case in which the uniformity in the functionallayers cannot be realized among the pixel electrodes. It is consideredthat the reason for this is because a part of the bank section which isprocessed to be lyophilic is a very small area around the pixelelectrode; therefore, the composition does not spread due to factorssuch as surface tension.

DISCLOSURE OF INVENTION

The present invention was made in consideration for the above situation.An object of the present invention is to provide a display device andmanufacturing method therefore which can realize a superior displayquality without causing non-uniformity in the functional layer per eachpixel electrode.

In order to achieve the above object, the present invention employs thefollowing structures.

The manufacturing method for a display device according to the presentinvention is characterized in that the manufacturing method for adisplay device has a bank section between functional layers formed onelectrodes by forming a bank section around a plurality of electrodesformed on a base body and forms the functional layers on each of theelectrodes by injecting a composition from a plurality of nozzles, anozzle arrays where a plurality of the nozzles are disposed scan on thebase body in a diagonal manner in a main scanning direction, and liquiddrops of the compositions which are initially injected for eachfunctional layer are injected so as to contact at least a part of thebank section.

According to such a manufacturing method for a display device, theliquid drops of the composition which are initially injected for eachfunctional layer contact at at least a part of the bank section and theliquid drops are transported from the bank section to a surface of theelectrode; therefore, it is possible that the liquid drop of thecomposition is preferentially applied around the electrode uniformly.Thus, it is possible to form the functional layer in approximatelyuniform thickness.

Also, the manufacturing method for a display device according to thepresent invention is characterized in that a region which is processedto be lyophilic and a region which is processed to be water-repellantare formed in the bank section, and the liquid drop of the compositioncontacts the water-repellant region.

By such manufacturing method for the display device, the liquid drops ofthe composition contacts a region of the bank section which is processedto be lyophilic; thus, it is possible that the liquid drops can betransported from the bank section to a surface of the electrode quickly;thus, it is possible to preferentially spread the liquid drops of thecomposition around the electrode quickly.

Also, the manufacturing method for a display device according to thepresent invention is characterized in that the bank section is formed bya first bank layer which is processed to be lyophilic and a second banklayer which is processed to be water-repellant, and the first bank layeris formed so as to overlap a part of the electrode.

According to such manufacturing method for a display device, the firstbank layer which is processed to be lyophilic is formed to overlap apart of the electrode; the composition spreads on the first bank layersooner than on the electrode. Thus, it is possible to apply thecomposition uniformly.

Next, the manufacturing method for a display device according to thepresent invention in which functional layers are formed on each of aplurality of electrodes formed on a base body and bank sections areprovided between the functional layers is characterized in comprisingsteps of bank section forming step for forming the bank sections so asto overlap a part of the electrode, lyophilizing step for processing atleast a part of the electrodes to be lyophilic, water-repelling step forprocessing a part of the bank sections to be water-repellant, functionallayer forming step for forming at least a functional layer on each ofthe electrode by injecting the compositions from a plurality of thenozzles, and facing electrodes forming step for forming facingelectrodes on the functional layer. In the functional layer formingstep, while nozzle arrays where a plurality of the nozzles are disposedscan on the base body in a diagonal manner in a main scanning direction,the liquid drops of the compositions which are initially injected foreach functional layer are injected so as to contact at least a part ofthe bank section.

According to such manufacturing method for a display device, the liquiddrops of the composition which are initially injected for eachfunctional layer contact at at least a part of the bank section; thus,the liquid drops are transported from the bank section to a surface ofthe electrodes. Therefore, it is possible to preferentially apply theliquid drops of the compositions around the electrode uniformly.Therefore, it is possible to form the functional layer in a uniformthickness.

Also, the manufacturing method for a display device according to thepresent invention is characterized in that the bank section is formed bya first bank layer which is processed to be lyophilic in thelyophilizing step and a second bank layer which is processed to bewater-repellant in the water-repellant step, and the first bank layer isformed so as to overlap a part of the electrode.

According to such manufacturing method for a display device, the firstbank layer which is processed to be lyophilic is formed to overlap apart of the electrode; therefore, the composition spreads on the firstbank layer sooner than on the electrode. Therefore, it is possible toapply the composition uniformly.

Also, the manufacturing method for a display device according to thepresent invention is characterized in that the functional layer includesat least a positive hole implantation/transportation layer.

Also, the manufacturing method for a display device according to thepresent invention is characterized in that the functional layer includesat least an illuminating layer.

According to such manufacturing method for a display device, thefunctional layer includes a positive hole implantation/transportationlayer or an illuminating layer;

therefore, it is possible to form the positive holeimplantation/transportation layer or the illuminating layer in anapproximately uniform thickness.

Also, in the above functional layer forming step, each of the functionallayer may be formed by injecting liquid drops of the composition byplural times, and an interval for dropping the liquid drops may besmaller than a diameter of the liquid drop.

In such a case, scanning operation by the above nozzle arrays for eachfunctional layer may occur once.

Also, in the functional layer forming step, each of the functionallayers may be formed by injecting liquid drops of the composition pluraltimes, and an interval for dropping the liquid drops may preferably belarger than a diameter of the liquid drop.

In such a case, scanning operation by the above nozzle arrays to eachfunctional layer may be once or more than twice. In the case in whichthe scanning operation is performed plural times, it is preferable thatdifferent nozzles be used for each scanning operation for eachfunctional layer by the nozzle arrays.

Here, for such method using different nozzles, it is possible for thenozzle arrays to be shifted in a sub-scanning direction per scanningoperation for each functional layer by the nozzle arrays.

According to such a manufacturing method for a display device, differentnozzles in the nozzle arrays can be used for each scanning operation. Bydoing this, it is possible to reduce unevenness in the injection amountof the composition for each nozzle; thus, it is possible to reduceunevenness in the thickness of the functional layers. By doing this, itis possible to manufacture a display device having superior displayquality.

Next, the display device according to the present invention ischaracterized in being manufactured according to the manufacturingmethod for a display device according to any one of the aspects of thepresent invention.

Such a display device is manufactured according to the manufacturingmethod for the above display device; therefore, it is possible to reduceunevenness in the thickness of the functional layer and form thefunctional layer uniformly. Therefore, it is possible to improve thedisplay quality by the display device.

Next, the manufacturing method for a display device according to thepresent invention is characterized in having a bank section betweenfunctional layers formed on electrodes by forming a bank section arounda plurality of electrodes formed on a base body and forming thefunctional layers on each of the electrodes by injecting a compositionfrom a plurality of nozzles and an electronic apparatus having a drivingcircuit for driving the display device. Nozzle arrays where a pluralityof the nozzles are disposed scan on the base body in a diagonal mannerin a main scanning direction, and liquid drops of the compositions whichare initially injected for each functional layer are injected so as tocontact at least a part of the bank section.

According to the manufacturing method for an electronic apparatus, theliquid drops which are initially injected for each functional layercontact at least a part of the bank section. By doing this, the liquiddrops are transported from the bank section to a surface of theelectrode; thus, it is possible to preferentially apply the liquid dropsof the composition around the electrode uniformly. Therefore, it ispossible to form the functional layer in approximately uniformthickness.

Also, the manufacturing method for an electronic apparatus according tothe present invention is characterized in that a region which isprocessed to be lyophilic and a region which is processed to bewater-repellant are formed in the bank section, and the liquid drop ofthe composition contacts the water-repellant region.

According to such a manufacturing method for an electronic apparatus,the liquid drops of the composition contact the region of the banksection which is processed to be water-repellant. Therefore, it ispossible for the liquid drops to be transported from the bank section toa surface of the electrode quickly. Also, it is possible topreferentially spread the liquid drops of the composition around theelectrode quickly.

Also, the manufacturing method for an electronic apparatus according tothe present invention is characterized in that the bank section isformed by a first bank layer which is processed to be lyophilic and asecond bank layer which is processed to be water-repellant, and thefirst bank layer is formed so as to overlap a part of the electrode.

According to such a manufacturing method for an electronic apparatus,the first bank section which is processed to be lyophilic is formed tooverlap a part of the electrode; thus, the composition spreads on thefirst bank layer sooner than on the electrode. Thus, it is possible toapply the composition uniformly.

Also, the manufacturing method for a display device in which functionallayers are formed on each of a plurality of electrodes formed on a basebody and bank sections are provided between the functional layers and anelectronic apparatus having a driving circuit for driving the displaydevice is characterized in comprising steps of a bank section formingstep for forming the bank sections so as to overlap a part of theelectrode, lyophilizing step for processing at least a part of theelectrodes to be lyophilic, water-repelling step for processing a partof the bank sections to be water-repellant, functional layer formingstep for forming at least a functional layer on each of the electrode byinjecting the compositions from a plurality of the nozzles, and facingelectrodes forming step for forming facing electrodes on the functionallayer. In the functional layer forming step, while nozzle arrays where aplurality of the nozzles are disposed scan on the base body in adiagonal manner in a main scanning direction, the liquid drops oft,hecompositions which are initially injected for each functional layer areinjected so as to contact at least a part of the bank section.

According to such a manufacturing method for an electronic apparatus,the liquid drops of the composition which are initially injected foreach functional layer contact at least a part of the bank section. Bydoing this, the liquid drops are transported from the bank section to asurface of the electrode. Therefore, it is possible to preferentiallyapply the liquid drops of the composition around the electrodeuniformly; thus, it is possible to form the functional layer inapproximately uniform thickness.

Also, the manufacturing method for an electronic apparatus according tothe present invention is characterized in that the bank section isformed by a first bank layer which is processed to be lyophilic in thelyophilizing step and a second bank layer which is processed to bewater-repellant in the water-repellant step, and the first bank layer isformed so as to overlap a part of the electrode.

According to such a manufacturing method for an electronic apparatus,the first bank layer which is processed to be lyophilic is formed tooverlap a part of the electrode. Therefore, the composition spreads onthe first bank layer sooner than on the electrode; thus, it is possibleto apply the composition uniformly.

Also, the manufacturing method for an electronic apparatus according tothe present invention is characterized in that the functional layerincludes at least a positive hole implantation/transportation layer.

Also, the manufacturing method for an electronic apparatus according tothe present invention is characterized in that the functional layerincludes at least an illuminating layer.

According to such a manufacturing method for an electronic apparatus,the functional layer includes a positive holeimplantation/transportation layer or an illuminating layer. Therefore,it is possible to form the positive hole implantation/transportationlayer or the illuminating layer in approximately uniform thickness.

Also, in the functional layer forming step, each of the functional layermay be formed by injecting liquid drops of the composition plural times,and an interval for dropping the liquid drops may be smaller than adiameter of the liquid drop. In such a case, scanning operation bynozzle arrays for each of the functional layer may be performed once.

Also, in the functional layer forming step, each of the functional layermay be formed by injecting liquid drops of the composition by pluraltimes, and an interval for dropping the liquid drops may preferably belarger than a diameter of the liquid drop. In such a case, scanningoperation by nozzle arrays for each of the functional layer may beperformed once or twice or more. Furthermore, if the scanning operationis performed plural times, a different nozzle may preferably be used foreach scanning operation by the nozzle arrays for each functional layer.

Here, for such methods using different nozzles, it is possible for thenozzle arrays to be shifted in a sub-scanning direction per scanningoperation for each functional layer by the nozzle arrays.

According to such manufacturing method for a display device, differentnozzles in the nozzle arrays can be used for each scanning operation. Bydoing this, it is possible to reduce unevenness in the injection amountof the composition for each nozzle; thus, it is possible to reduceunevenness in the thickness of the functional layers.

By doing this, it is possible to manufacture an electronic apparatushaving superior display quality.

Next, an electronic apparatus according to the present invention ischaracterized to be manufactured according to the manufacturing methodfor the electronic apparatus which is previously described in any one ofaspects of the present invention.

According to such an electronic apparatus, it is possible to reduceunevenness in the thickness of each functional layer and form afunctional layer uniformly. Therefore, it is possible to improve displayquality in the electronic apparatus.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a plan view for wiring structure of a display device accordingto a first embodiment of the present invention.

FIGS. 2A and 2B show a display device according to the first embodimentof the present invention. FIG. 2A is a plan view, and FIG. 2B is a crosssection viewed in a line AB shown in FIG. 2A.

FIG. 3 shows an important section in a display device according to thefirst embodiment of the present invention.

FIG. 4 is a cross section for showing manufacturing method for a displaydevice according to the first embodiment of the present invention.

FIG. 5 is a cross section for showing manufacturing method for a displaydevice according to the first embodiment of the present invention.

FIG. 6 is a plan view of a plasma-processing device which is used formanufacturing a display device according to a first embodiment of thepresent invention.

FIG. 7 is a view showing an internal structure of a first plasmaprocessing chamber in a plasma processing device shown in FIG. 6.

FIG. 8 is a cross section for showing manufacturing method for a displaydevice according to the first embodiment of the present invention.

FIG. 9 is a cross section for showing manufacturing method for a displaydevice according to the first embodiment of the present invention.

FIG. 10 is a plan view showing other example of the plasma processingdevice which is used for manufacturing a display device according to thefirst embodiment of the present invention.

FIG. 11 is a plan view showing a head which used for manufacturing adisplay device according to the first embodiment of the presentinvention.

FIG. 12 is a plan view showing an ink jet device which is used formanufacturing a display device according to the first embodiment of thepresent invention.

FIG. 13 is a perspective view for showing an example of an ink jet headwhich is used for manufacturing a display device according to the firstembodiment of the present invention.

FIGS. 14A and 14B are views showing internal structure of the ink jethead shown in FIG. 13. FIG. 14A is a perspective view and FIG. 14B is across section along a line J-J shown in FIG. 14A.

FIG. 15 is a plan view showing disposition condition of the ink jet headfacing to a base body.

FIG. 16 is a cross section showing a manufacturing method for which isused for manufacturing a display device according to the firstembodiment of the present invention.

FIGS. 17A to 17C are views for showing manufacturing method for adisplay device according to the first embodiment of the presentinvention. FIG. 17A is a cross section showing a condition in that aninitial liquid drop is injected. FIG. 17B is a cross section for showingother example of condition in that the liquid drops are injected afterthe initial liquid drop is injected. FIG. 17C is a cross section showinganother example of conditions in which the liquid drops later than in asecond time are injected.

FIG. 18 is a cross section showing a manufacturing method for a displaydevice according to the first embodiment of the present invention.

FIG. 19 is a cross section showing a manufacturing method for a displaydevice according to the first embodiment of the present invention.

FIG. 20 is a cross section showing a manufacturing method for a displaydevice according to the first embodiment of the present invention.

FIG. 21 is a cross section showing a manufacturing method for a displaydevice according to the first embodiment of the present invention.

FIG. 22 is a cross section showing a manufacturing method for a displaydevice according to the first embodiment of the present invention.

FIG. 23 is a cross section showing a manufacturing method for a displaydevice according to the first embodiment of the present invention.

FIG. 24 is a cross section showing a manufacturing method for a displaydevice according to the first embodiment of the present invention.

FIGS. 25A to 25C are perspective views for showing electronicapparatuses in a second embodiment of the present invention.

FIG. 26 is a cross section of a display device according to otherembodiment of the present invention.

FIG. 27 is a cross section of a display device according to anotherembodiment of the present invention.

FIGS. 28A to 28C are plan views showing disposition of illuminatinglayers. FIG. 28A shows stripe disposition. FIG. 28B shows mosaicdisposition. FIG. 28C shows delta disposition.

BEST MODE FOR CARRYING OUT THE INVENTION First Embodiment

A display device and manufacturing method therefor according to a firstembodiment in the present invention are explained as follows withreference to the drawings. Before explaining manufacturing method for adisplay device according to the present embodiment, a display devicewhich is manufactured according to the manufacturing method of thepresent invention is explained.

In FIG. 1, a plan view is shown to explaining wiring structure in adisplay device according to the present embodiment. In FIGS. 2A and 2B,a plan view and a cross section are shown to explain a display device ofthe present invention.

As shown in FIG. 1, in a display device 1 according to the presentinvention, a plurality of scanning lines 101, a plurality of signallines 102 which extend in a crossing direction to the scanning lines101, and a plurality of power supply lines 103 which extend in parallelwith the signal lines 102 are disposed. Also, a pixel area A is disposedat each cross point of the scanning line 101 and the signal line 102. Adata driving circuit 104 which is provided with a shift register, alevel shifter, a video line, and an analogue switch is connected to thesignal line 102. A scan driving circuit 105 which is provided with ashift register and a level shifter is connected to the scanning line101.

Furthermore, a switching thin film transistor 112 supplying the scanningsignal to a gate electrode via the scanning line 101, a retainingcapacity cap for retaining a pixel signal which is supplied from thesignal line 102 via the switching thin film transistor 112, and adriving thin film transistor 123 for supplying the pixel signa which isretained in the retaining capacity cap to the gate electrode, a pixelelectrode (electrode) 111 to which a driving current flows in from thepower supply line 103 when the pixel electrode 111 is connected to apower supply line 103 via the driving thin film transistor 123electrically, and a functional layer 110 which is sandwiched between thepixel electrode 111 and a cathode (facing electrode) 12 are provided ineach pixel area A An illuminating element is made by the electrode 111,a facing electrode 12, and the functional layer 110.

By such a structure, when the scanning line 101 is driven and theswitching thin film transistor 112 is turned on, temporary electricalpotential in the signal line 102 is retained in the retaining capacitycap. On/off condition of the driving thin film transistor 123 isdetermined according to the condition of the retaining capacity cap.

The electric current flows from the power supply line 103 to the pixelelectrode 111 via a channel of the driving thin film transistor 123, andfurthermore, the electric current flows in the cathode 12 via thefunctional layer 110. The functional layer 110 illuminates according tothe amount of electric current flowing therein.

Next, as shown in FIGS. 2A and 2B, a display device 1 according to thepresent embodiment is provided with a transparent base body 2 made ofglasses, an illuminating element which is disposed in a matrix, and asealing base board. The illuminating element which is formed on the basebody 2 is formed by a pixel electrode which is explained later, afunctional layer, and a cathode 12.

The base body 2 is, for example, a transparent glass base board and isdivided in a display area 2 a which is disposed in a center of the basebody 2 and a no-display area which is disposed outside of the displayarea around a periphery of the base body 2.

The display area ² a is formed by an illuminating element which isdisposed in a matrix as an effective display area. A no-display area 2 bis formed outside the display area. A dummy display 2 d neighboring thedisplay area 2 a is formed in the no-display area 2 b.

Also, as shown in FIG. 2B, a circuit element section 14 is providedbetween the illuminating element section 11 which is formed by theilluminating element and the bank section and the base body 2. Thecircuit element section 14 is provided with the scanning line, thesignal line, the retaining capacity, the switching thin film transistor,and the driving thin film transistor 123 which are explained previously.

Also, an end of the cathode 12 is connected to a cathode wiring 12 awhich is formed on the base body 2, and an end section 12 b is connectedto a siring 5 a on a flexible base board 5. Also, the wiring 5 a isconnected to a driving IC (driving circuit) 6 which is provided on theflexible base board 5.

Also, as shown in FIGS. 2A and 2B, the power supply line 103 (103R,103G, 103B) is disposed in the no-display area 2 b in the circuitelement 14.

The scanning driving circuit 105, 105 are disposed on both ends in thedisplay area 2 a shown in FIG. 2A. The scanning driving circuits 105 and105 are provided in the circuit element section 14 beneath a dummy area2 d. Furthermore, a circuit driving control signal wiring 105 a which isconnected to the scanning driving circuits 105 and 105, and a drivingcircuit power supply line 105 b are provided in the circuit elementsection 14.

Furthermore, an inspection circuit 106 is disposed on an upper area ofthe display area 2 a shown in FIG. 2A. It is possible to inspect qualityof the display device during a manufacturing process therefor and as afinal product without defect.

Also, as shown in FIG. 2B, a sealing section 3 is provided on theilluminating element 11. The sealing section 3 is formed by a sealingresin 603 a which is applied on the base body 2 and a can sealing baseboard 604. The sealing resin 603 is a thermally curable resin or anultraviolet ray curable resin. In particular, the sealing resin 603should preferably be formed by an epoxy resin which is a type of thethermally curable resin.

The sealing resin 603 is applied around the base body 2 in circulardisposition by using, for example, a micro-dispenser. The sealing resin603 attaches the base body 2 to a sealing can 604. The sealing resin 604prevents water or oxygen from entering from between the base body 2 andthe can sealing base board 604 to the inside of the can sealing baseboard 604. The sealing resin 604 also prevents the illuminating layer,not shown in the drawing, which is formed in the cathode 12 or theilluminating element section 11 from being oxidized.

The can sealing base board 604 is a glass or a metal. The can sealingbase board 604 is attached to the base body via the sealing resin 603. Aconcave section 604 a for containing the display element 10 is formedinside of the can sealing base body 604. A getter agent which absorbs awater and an oxygen 605 is bonded on the concave section 604 a so as toabsorb the water or the oxygen which enter in the can sealing base body604. Here, it is acceptable that the getter agent 605 is omitted.

Next, FIG. 3 is an enlarged view of cross section of the display area inthe display device. In FIG. 3,.three pixel areas A are shown. On thebase board 2 of the display device 1, the circuit element section 14 onwhich circuits such as TFT are formed and the illuminating elementsection 11 on which the functional layer 110 is formed are layeredalternately.

In the display device 1, a light which is emitted from the functionallayer 110 toward the base body 2 is transported through the circuitelement section 14 and the base body 2 so as to be emitted beneath thebase body 2 (toward an observer). Also, the light which is emitted fromthe functional layer 110 opposite to the base body 2 is reflected by thecathode 12 an transported through the circuit element section 14 and thebase body 2 so as to be transported beneath the base body 2 (toward anobserver).

Here, if a transparent cathode 12 is used, it is possible to emit alight which illuminates from the cathode. For such a transparent member,ITO, Pt, Ir, Ni, or Pd can be used 75 nm thickness is preferable. Morepreferably, thinner thickness is preferred.

A base protecting layer 2 c made from a silicon oxide layer is formed onthe base board 2 in the circuit element section 14. An islandsemiconductor layer 141 made from a polysilicon is formed on the baseprotection layer 2 c. Here, a source area 141 a and a drain area 141 bare formed on the semiconductor layer 141 by high-density P-ionimplanting. Here, an area where P is not introduced is a channel area 14c.

Furthermore, a transparent gate insulating layer 142 which covers thebase protection layer 2 c and the semiconductor layer 141 is formed inthe circuit element section 14. A gate electrode 143 (scanning line 101)made from a metal such as Al, Mo, Ta, Ti, and W is formed on the baseinsulating layer 142. A transparent first inter-layer insulating layer144 a an a second inter-layer insulating layer 144 b are formed on thegate electrode 143 and the gate insulating layer 142. The gate electrode143 is disposed in a position which corresponds to a channel area 141 cin the semiconductor layer 141.

Also, contact holes 145 and 146 through the first and second inter-layerinsulating layer 114 a and 144 b so as to be connected to the sourcearea in the semiconductor layer 141 and the drain area of thesemiconductor layer 141 respectively are formed.

A transparent pixel electrode 111 made of an ITO, etc., is formed on thesecond inter-layer insulating layer 144 b in a predetermined shape by apatterning operation. One of the of the contact hole 145 is connected tothe pixel electrode 111.

Also, the contact hole 146 is connected to the power supply line 103.

By doing this, a driving thin film transistor 123 which is connected toeach pixel electrode 111 is formed in the circuit element section 14.

Here, although the retaining capacity cap and the switching thin filmtransistor 112 is formed which are explained previously are formed inthe circuit element section 14, these are not shown in FIG. 3.

Next, as shown in FIG. 3, the illuminating element section 11 is formedmainly by the functional layer 110 which is layered on a plurality ofpixel electrode 111, a bank section 112 which is disposed between eachof the pixel electrode and the functional layer 110 so as to separateeach of the functional layer 110, and the cathode 12 (second electrode)which is formed on the functional layer 110. The illuminating element isformed by the pixel element (first element) 111, the functional layer110, and the cathode (second electrode).

Here, the pixel electrode 111 is formed by, for example, a metal such asITO. The pixel electrode 111 is formed in approximately rectangular inplan view by a patterning operation. Thickness of the pixel electrode111 should preferably be in a range of 50 to 200 nm, in particular,nearly 150 nm is more preferable. A bank section 112 is disposed betweeneach of the pixel electrodes 111 a and 111.

As shown in FIG. 3, bank section 112 is formed by an inorganic banklayer 112 a (first bank layer) which is disposed near the base body 2and an organic bank layer 112 b (second bank layer) which is disposedfarther from the base body 2 thereon.

The inorganic bank layer and the organic bank layer (112 a and 112 b)are formed so as to overlap a periphery of the pixel electrode 111. In aplan view, the periphery of the pixel electrode 111 and the inorganicbank layer 112 a are overlapping. Also, the organic bank layer 112 b hasthe same structure; thus, the bank layer 112 overrides a part of thepixel electrode 111. Also, the inorganic bank layer 112 a is formed inmore center of the pixel electrode 111 than the organic bank layer 112b. By doing this, each of first layer section 112 e in the inorganicbank layer 112 a is formed inside of the pixel electrode 111. By doingthis, a lower opening section 112 c is disposed so as to correspond to aposition of the pixel electrode 111.

Also, an upper opening section 112 d is formed in the organic bank layer112 b. The upper opening section 112 d is disposed so as to correspondto positions of the pixel electrode 111 and the lower opening section112 c. As shown in FIG. 3, the upper opening section 112 d is formed soas to be larger than the lower opening section 112 c and narrower thanthe pixel electrode 111. Also, there is a case in which the position ofan upper part of the upper opening section 112 d and an end of the pixelelectrode 111 are approximately the same. In such a case, as shown inFIG. 3, cross section of the upper opening section 112 d in the organicbank layer 112 b is diagonal.

In addition, an opening section 112 which penetrates through theinorganic bank layer 112 a and the organic bank layer 112 b is formed inthe bank section 112 by communicating through the lower opening section112 c and the upper opening section 112 d.

Also, it is preferable that the inorganic bank layer 112 a be aninorganic member such as SiO₂, or TiO₂. Thickness of the inorganic banklayer 112 a should preferably be in a range of 50 to 200 nm, moreparticularly, 150 nm. If the thickness is less than 50 nm, the thicknessof the inorganic bank layer 112 a is thinner than a positive holeimplantation/transportation layer which is to be explained; thus, it isnot preferable because it is impossible to realize flatness of thepositive hole implantation/transportation layer. Also, if the inorganicbank layer 112 a is thicker than 200 nm, a gap made by the lower openingsection 112 c becomes larger; thus, it is impossible to realize flatnessof an illuminating layer which is layered on the positive holeimplantation/transportation layer to be explained later. Thus, it is notpreferable.

Furthermore, the organic bank layer 112 b is made from a heat-resistiveand solution-resistive resist such as acryl resin, and polyimide resin.It is preferable that the thickness of the organic bank layer 112 b bein a range of 0.1 to 3.5 μm, in particular, nearly 2 μm. If thethickness is less than 0.1 μm, the organic bank layer 112 b becomesthinner than the total thickness of the positive holeimplantation/transportation layer which is to be explained and theilluminating layer; thus, it is not preferable because there is aconcern that the illuminating layer spills over the upper openingsection 112 d.

Also, if the thickness is larger than 3.5 μm, a gap made by the upperopening section 112 d becomes larger; thus, it is not preferable becauseit does not yield a step coverage by the cathode 12 which is formed onthe organic bank layer 112 b. Also, if the organic bank layer 112 b isthicker than 2 μm, it is possible because it is possible to enhanceinsulation to the driving thin film transistor 123.

Also, an area which indicates lyophilic characteristics and an areawhich indicates water-repellant characteristics are formed in the banksection 112.

The area which indicates lyophilic characteristics are the first layeredsection 112 e in the inorganic bank layer 112 a and a surface 111 a ofthe pixel electrode 111. Surfaces of these areas are processed to belyophilic by performing plasma processing operation using a processinggas such as oxygen. The area which exhibits water-repellantcharacteristics are the wall surface of the upper opening section 112 dand an upper surface 112 f of the organic bank layer 112. Surfaces ofthese areas are processed by a plasma processing operation by using aprocessing gas such as tetrafluoromethane (water-repellant).

Next, as shown in FIG. 3, the functional layer 110 is formed by apositive hole implantation/transportation layer 110 a which is layeredon the pixel electrode 111 and an, illuminating layer 110 b which isformed next to the positive hole implantation/transportation layer 110a. Here, it is acceptable that other functional layer having functionsuch as an electron implantation transportation layer is further formednext to the illuminating layer 110 b.

The positive hole implantation/transportation layer 110 a has a functionfor implant a positive hole in to the illuminating layer 110 b and fortransport the positive hole in the positive holeimplantation/transportation layer 110 a. By disposing such positive holeimplantation/transportation layer 110 a between the pixel electrode 111and the illuminating layer 110 b, superior characteristics in theilluminating layer 110 b such as illuminating efficiency and the productlife can be obtained. Also, the positive hole which is implanted fromthe positive hole implantation/transportation layer 110 a and anelectron which is implanted from the cathode 12 are united again in theilluminating layer 110 b; thus, illuminating function can be realized.

The positive hole implantation/transportation layer 110 a is formed by aflat section 110 a 1 which is formed in the lower opening section 112 con the pixel electrode surface 111 a and a peripheral section 110 a 2which is formed in the upper opening section 112 d on the first layersection 112 e of the inorganic bank layer. Also, the positive holeimplantation/transportation layer 110 a is formed only between theinorganic bank layers 110 a (lower opening section 110 c) on the pixelelectrode 111; thus, such a disposition may depend on its structure, andit is acceptable for the positive hole implantation/transportation layer110 a to be formed only on the flat section).

Thickness of the flat section 110 a 1 is constant, for example, within arange of 50 to 70 nm.

When the periphery section 110 a 2 is formed, the periphery section 110a 2 is disposed on the first layer section 112 e and contacts a wallsurface of the upper opening section 112 d, such as the organic banklayer 112 b closely. Also, the thickness of the periphery section 110 a2 is thin near the surface 111 a of the electrode and increases in adirection away from the surface 111 a of the electrode. The thickness ofthe periphery section 111 a 2 is the thickest near the wall surface ofthe lower opening section 112 d.

The periphery section 110 a 2 has various shapes because the positivehole implantation/transportation layer 110 a is formed by injecting afirst composition including a positive hole implantation/transportationlayer forming member and polar solution in the opening section 112 andremoving the polar solution, the polar solution evaporates mainly on thefirst layer section 112 e on the inorganic bank layer; thus, thepositive hole implantation/transportation layer forming member iscondensed and extracted collectively on the first layer section 112 e.

Also, the illuminating layer 110 b is formed on the flat section 110 a 1of the positive hole implantation/transportation layer 110 a and theperiphery section 110 a 2. The thickness of the illuminating layer 110 bis in a range of 50 to 80 nm on the flat section 112 a 1.

The illuminating layer 110 b has three colors such as a red illuminatinglayer 110 b 1 for illuminating in red (R), a green illuminating layer110 b 2 for illuminating in green (G), and a blue illuminating layer 110b 3 for illuminating in blue (B). Illuminating layer 110 b 1 to 110 b 3are disposed in a stripe.

As explained above, the periphery section 110 a 2 of the positive holeimplantation/transportation layer 110 a contacts the wall surface(organic bank layer 112 b) of the upper opening section 112 d closely;therefore, the illuminating layer 110 b does not contact the organicbank layer 112 b directly. Therefore, it is possible to prevent waterwhich is contained as an impurity in the organic bank layer 112 b frombeing migrating to the illuminating layer 110 b by using the peripherysection 112 a 2; thus, it is possible to prevent the illuminating layer110 b from being oxidized.

Also, the periphery section 110 a 2 having non-uniform thickness isformed on the first layer section 112 e in the inorganic bank layer.Thus, the periphery section 110 a 2 is insulated from the pixelelectrode 111 by the first layer section 112 e. Therefore, the positivehole is not implanted from the periphery section 110 a 2 into theilluminating layer 110 b. By doing this, electric current flows from thepixel electrode 111 only the flat section 112 a 1; thus, it is possibleto transport the positive hole from the flat section 112 a 1 to theilluminating layer 110 b uniformly. Therefore, it is possible toilluminate only a central area of the illuminating layer 110 b andequalize the illumination amount in the illuminating layer 110 b.

Also, the inorganic bank layer 112 a extends in more inwardly of thepixel electrode 111 by the inorganic bank layer 112 b. Thus, it ispossible to trim shape of the connecting part of the pixel electrode 111and the flat section 110 a 1 by the inorganic bank layer 112 a;therefore, it is possible to reduce non-uniformity of illuminationintensity between the illuminating layers 110 b.

Furthermore, the surface 111 a of the pixel electrode 111 and the firstlayer section 112 e of the inorganic bank layer indicate the lyophiliccharacteristics; therefore, the functional layer 110 closely contactsthe pixel electrode 111 and the inorganic bank layer 112 a uniformly.Thus, the functional layer 110 does not become extremely thin on theinorganic bank layer 112 a; therefore, it is possible to prevent ashort-circuit from occurring between the pixel electrode 111 and thecathode 12.

Also, an upper surface 112 f of the organic bank layer 112 b and thewall surface of the upper opening section 112 d indicate water-repellantcharacteristics; therefore, contact between the functional layer 110 andthe organic bank layer 112 b is reduced; thus, there is not a case inwhich the functional layer 110 is formed such that the functional layer110 spills over the opening section 112 g.

For a member for forming a positive hole implantation/transportationlayer, for example, a mixture of polythiophene derivative such aspolyethylene dioxythiophene and polystyrene sulfonic acid can be used.For a member for forming the illuminating layer 110 b, polyfluorenederivative such as compositions 1 to 5, or (poly-)p-phenylene vinylenederivative, polyphenylene derivative, polyfluorene derivative, polyvinylcarbazole, polythiophene derivative can be used. Also, above polymermember can be used by doping a member such as perylene dye, coumarindye, rhodamine dye, rubrene, perylene, 9,10-diphenylanthracene,tetraphenylbutadiene, Nile-red, coumarin 6, quinacridone.

Next, a cathode 12 is formed on an entire surface of the illuminatingelement 11. The cathode 12 is coupled with the pixel electrode 111 so asto flow electric current to the functional layer 110. The cathode 12 canbe formed by layering a calcium layer and an aluminum layer. In such acase, it is preferable to dispose the calcium layer or the aluminumlayer having low work function on the cathode which is disposed near theilluminating layer. In particular, in the present embodiment, thecathode 12 works for implanting an electron into the illuminating layer110 b by contacting the illuminating layer 110 b directly. Also, in alithium fluoride, a LiF can be formed between the illuminating layer 110and the cathode 12 so as to illuminate efficiently.

Here, the red illuminating layer 110 b 1 and the red illuminating layer110 b 2 are not limited to a lithium fluoride; thus, it is acceptable touse another member. Therefore, in such a case, a layer made of thelithium fluoride is formed only in the blue (B) illuminating layer 110 b3 and other members are layered in the red illuminating layer 110 b 1and the green illuminating layer 110 b 2. Also, it is acceptable thatonly the calcium be formed on the red illuminating layer 110 b 1 and thegreen illuminating layer 110 b 2 instead of the lithium fluoride.

Here, thickness of the lithium fluoride is preferably in a range of 2 to5 nm, in particular, near 2 nm. Also, the thickness of the calcium ispreferably in a range of 2 to 50 nm, in particular, near 20 nm.

Also, the aluminum which forms the cathode 12 reflects the light whichis emitted from the illuminating layer 110 b toward a base body 2;therefore, the aluminum for forming the cathode 12 should preferably bemade of an Al layer, Ag layer, and a layered structure of Al and Ag.Also, the thickness should preferably be in a range between 100 to 1000nm, in particular, near 200 nm.

Furthermore, it is acceptable that a protection layer made of metal suchas SiO, SiO₂, SiN be disposed on the aluminum for preventing theoxidization.

Here, a sealing can 604 is disposed on the illuminating element which isformed in this way. As shown in FIG. 2B, the sealing can 604 is bondedby a sealing resin 603; thus, a display device 1 is formed.

Next, manufacturing method for a display device according to the presentembodiment is explained with reference to the drawings.

Manufacturing method for the display device 1 according to the presentembodiment comprises processes of (1) bank section forming process, (2)plasma processing (including an lyophilic process and a water-repellantprocess), (3) positive hole implantation/transportation forming process(functional layer forming process), (4) illuminating layer formingprocess (functional layer forming process), (5) facing electrode formingprocess, and (6) sealing process. Here, manufacturing processes in thepresent embodiment is not limited to the above method. It is acceptablethat other process be omitted or added according to necessity.

(1) Bank Forming Process

In a bank forming process, a bank section 112 is formed on apredetermined position on the base body. The bank section 112 is formedby an inorganic bank layer 112 a as a first bank layer and an organicbank layer 112 b as a second bank layer.

Forming method is explained as follows.

(1)-1 Forming Inorganic Bank Layer

First, as shown in FIG. 4, an inorganic bank layer 112 a is formed in apredetermined position on the base body. The inorganic bank layer 112 isformed on a second inter-layer insulating layer 114 b and an electrode(pixel electrode here) 111.

Here, the second inter-layer insulating layer 144 b is formed on acircuit element section 14 on which a thin film transistor, a scanningline, and a signal line are formed.

For an inorganic bank layer 112 a, for an example, inorganic layer suchas SiO₂ or TiO₂ can be used. These members can be formed by CVD method,Coating method, Sputtering method, or vacuum deposition method.

Furthermore, thickness of the inorganic bank layer 112 a is preferableto be in a range of 50 to 200 nm, in particular, 150 nm.

The inorganic bank layer 112 having an opening section is formed byforming an inorganic layer on the inter-layer insulating layer 114 andan entire surface of the pixel electrode 111 and performing patterningoperation to the inorganic layer by a photolithograph method or thelike. The opening section corresponds to a position where the surface111 a of the pixel electrode 111. As shown in FIG. 4, the openingsection is disposed as a lower opening section 112 c.

In this case, the inorganic bank layer 112 a is formed so as to overlapa periphery section (a part) of the pixel electrode 111. As shown inFIG. 4, by forming the inorganic bank layer 112 a such that theinorganic bank layer 112 a overlaps a part of the pixel electrode 111,it is possible to control an illuminating area in the illuminating layer110.

(1)-2 Forming Organic Bank Layer 112 b

Next, an organic bank layer 112 b is formed as a second bank layer.

As shown in FIG. 5, an organic bank layer 112 b is formed on aninorganic bank layer 112 a. For an organic bank layer 112 b, a memberhaving heat-resistance and solution-resistance such as an acrylic resin,or a polyimide resin is used the organic bank layer 112 b is formed byperforming patterning operation by using these members. Here, in thepatterning operation, an upper opening section 112 d is formed in theorganic bank layer 112 b. The upper opening section 112 d is disposedcorresponding to the surface 111 a of the pixel electrode and the loweropening section 112 c.

It is preferable that the upper opening section 112 is formed to belarger than the lower opening section 112 c which is formed in theinorganic bank layer 112 a as shown in FIG. 5. Furthermore, it ispreferable that the shape of the organic bank layer 112 b be tapered. Itis preferable that an opening section of the organic bank layer benarrower than a width of the pixel electrode 111. Also, it is preferablethat the width of the opening section of the organic bank layer beapproximately the same as that of the pixel electrode 111 on anuppermost surface of the organic bank layer 112 b. By doing this, thefirst layer section 112 e which surrounds the lower opening section 112c on the inorganic bank layer 112 a expands more centerally in the pixelelectrode 111 than the organic bank layer 112 b.

By communicating the upper opening section 112 d which is formed on theorganic bank layer 112 b and the lower opening section 112 c which isformed in the inorganic bank layer 112 a in this way, an opening section112 g which communicates through the inorganic bank layer 112 a and theorganic bank layer 112 b is formed.

Here, the thickness of the organic bank layer 112 b is preferably in arange of 0.1 to 3.5 μm, in particular, near 2 μm. The reason why such arange is preferable is as follows.

That is, if the thickness is smaller than 0.1 μm, the thickness of theorganic bank layer 112 b is smaller than a total thickness of thepositive hole implantation/transportation layer and it may occur thatthe illuminating layer 110 b spills over the upper opening section 112d; thus, it is not preferable. If the thickness exceeds 3.5 μm, a gapmade by the upper opening section 112 d becomes larger and it is notpossible to obtain a step coverage by the cathode 12 in the upperopening section 112 d; thus, it is not preferable. If the thickness ofthe organic bank layer 112 b is larger than 2 μm, it is possible toenhance the insulation between the cathode 12 and the driving thin filmtransistor 123; thus, it is preferable.

(2) Plasma Processing Operation

Next, a plasma processing operation is performed for purposes ofactivating a surface of the pixel electrode 111 and performing a surfaceprocessing for the bank section 112. In particular, purposes in theactivating operation are to clean the pixel electrode 111 (ITO) andadjusting operating functions. Furthermore, the activating operationperforms a lyophilic operation (lyophilic process) on a surface of thepixel electrode 111 and a water-repellant operation (water-repellantprocess) on a surface of the bank section 112.

The plasma processing operation can be categorized, for example, into(2)-1 a preliminary heating process, (2)-2 an activating process(lyophhilic process), (2)-3 a water-repellant process (lyophilicprocess), and (2)-4 a cooling process. Here, the plasma processingoperation is not limited to these categories and process therein can beomitted or added according to necessity.

First, FIG. 6 shows a plasma processing device which is used forperforming a plasma processing operation. A plasma processing device 50shown in FIG. 6 is formed by a preliminary heating chamber 51, a firstplasma processing chamber 52, a second plasma processing chamber 53, acooling processing chamber 54, and a handling device for handling a basebody 2 to these chambers 51 to 54. These chambers 51 to 54 are disposedin a radial manner around the handling device 55.

The general process is explained by using these devices.

A preliminary heating process is performed in the preliminary heatingprocessing chamber 51 shown in FIG. 6. A base body 2 which is handledfrom the bank section forming process is heated at a predeterminedtemperature in the preliminary heating processing chamber 51.

A lyophilic process and a water-repellant process are performed afterthe preliminary heating process. That is, the base body is transportedto a first plasma processing chamber 52 and the second plasma processingchamber 53 subsequently. The plasma processing operation is performed tothe bank section 112 in each chamber so as to be lyophilic. Awater-repellant process is performed after the lyophilic processing. Thebase body is transported to a cooling processing chamber after thewater-repellant process and the base body is cooled down to roomtemperature in the cooling processing chamber 54. The base body istransported to a next process so as to perform a positive holeimplantation/transportation layer forming process by the handling deviceafter the cooling processing operation.

Each process is explained in detail as follows.

(2)-1 Preliminary Heating Process

A preliminary heating process is performed in the preliminary heatingprocessing chamber 51. The base body 2 including the bank section 112 bis heated to a predetermined temperature in the preliminary heatingprocessing chamber 51.

The base body 2 is heated by a heater which is attached to a stage formounting a base body thereon in the preliminary heating processingchamber 51 so as to heat the base body 2 and the stage. For a heatingmethod, other method can be employed.

The base body 2 is heated in a temperature range of, for example, 70° C.to 80° C. in the preliminary heating processing chamber 51. Such atemperature is employed in a next process such as a plasma processingoperation. The purpose for employing such a temperature is to heat thebase body 2 so as to correspond a conditions in a next process andreduce unevenness in the temperature of the base body 2.

If there is no preliminary heating process, the base body 2 is heated inthe above temperature. Under such a condition, the plasma processingoperation is performed to the base body 2 from the beginning to the endwith a continuous variation of the temperature. There is a possibilitythat the characteristics in an organic EL element may become uneven whenthe plasma processing operation is performed while the temperature ofthe base body changes. Therefore, the preliminary heating process isperformed so as to maintain the process conditions constant and realizeuniform characteristics.

Here, when the lyophilic process and a water-repellant process areperformed under conditions that the base body 2 is mounted on a samplestage in the first plasma processing device 52 and the second plasmaprocessing device 53 in the plasma processing operation, it ispreferable that the preliminary heating process temperature shouldapproximately be the same as that of the sample stage 56 in whichlyophilic processes and the water-repellant processes are performed.

Here, the preliminary heating process is performed to the base body 2 ina temperature such as. 70° C. to 80° C. to which the temperature of thesample stage in the first plasma processing device 52 and the secondplasma processing device 53 increase. By doing this, the plasmaprocessing condition is approximately the same between before and afterthe plasma processing operation even if the plasma processing operationis performed on numeraous base bodies continuously. By doing this, it ispossible to maintain the condition for a surface processing of the basebody 2; thus, it is possible to equalize the wettability of the banksection 112 against the composition. Therefore, it is possible tomanufacture a display device having a constant quality.

Also, by performing a preliminary heating process in advance, it ispossible to shorten time for processing in the plasma processingoperation which is performed later.

(2)-2 Activating Process (Lyophilic Process)

An activating process is performed in the first plasma processingchamber 52. The activating process includes processes such as adjustingand controlling a work functions in the pixel electrode 111, cleaning asurface of the pixel electrode, and performing a lyophilic process for asurface of the pixel electrode.

In the lyophilic process, a plasma process (O₂ plasma process) usingoxygen as a process gas in an atmosphere. In FIG. 7, the plasmaprocessing operation is graphically shown. As shown in FIG. 7, the basebody 2 including the bank section 112 is mounted on the sample stage 56having a heater thereinside. A plasma discharging electrode 57 isdisposed on an upper surface of the base body 2 so as to face the basebody 2 having a gap distance such as 0.5 to 2 mm. The base body 2 isheated by the sample stage 56. Simultaneously, the sample stage 56 istransported in a direction which is indicated in FIG. 7 in apredetermined speed. During that period, oxygen in a plasma-state isemitted to the base body 2.

For O₂ plasma processing, conditions such as 100 to 800 kW of plasmapower, 50 to 100 ml/min of oxygen gas flow, 0.5 to 10 mm/sec of boardtransportation speed, 70 to 90° C. of base body temperature areacceptable. The sample stage 56 performs the heating operation so as tomainly maintain the temperature in the base body to which thepreliminary heating process is performed.

By the O₂ plasma processing, as shown in FIG. 8, lyophilic process isperformed to the surface 111 a of the pixel electrode 111, the firstlayer section 112 e in the inorganic bank layer 112 a, a wall surface ofthe upper opening section 112 d and an upper surface 112 f in theorganic bank layer 112 b. By the lyophlic process, a hydroxyl group isintroduced to each surface; thus, lyophilic characteristics is given.

FIG. 9, a broken line indicates the area to which the lyophilic processis performed.

Here, the O₂ plasma process not only gives lyophilic characteristics butalso cleans the pixel electrode such as ITO and adjusts the workfunctions compatibly.

(2)-3 Water-Repellant Process (Water-Repellant Operation)

Next, a plasma process (CF₄ plasma process) as a water-repellant processis performed in the second plasma processing chamber 53 using a processgas such as tetrafluoromethane in an atmosphere. The internal structureof the second plasma processing chamber 53 is the same as that of thefirst plasma processing chamber 52 shown in FIG. 7. That is, the basebody 2 is heated by the sample stage, and during that period, the basebody 2 and the sample stage are transported at a predetermined speed.During that period, the tetrafluoromethane in a plasma state is emittedto the base body 2.

CF₄ plasma process can be performed under conditions such as 100 to 800kW of plasma power, 50 to 100 ml/min of fluoromethane gas flow, 0.5 to10 mm/sec of base body transporting speed, 70° C. to 90° C. of base bodytemperature. The heating stage heats the base body 2 for a purpose ofmaintaining the temperature of the base body to which the preliminaryheating process is performed similarly to a case of the first plasmaprocessing chamber 52.

Here, a process gas is not limited to a tetrafluoromethane. Otherfluorocarbon gas can be used for a process gas.

By performing CF₄ plasma process, as shown in FIG. 9, lyophilic processis performed to a wall surface of the upper opening section 112 d and anupper surface 112 f of the organic bank layer. By the lyophilic process,a fluorine group is introduced to each surface; thus, water-repellantcharacteristics is given there. In FIG. 9, an area which indicates thewater-repellant characteristics is shown by a two-dot broken line.Lyophilic process can be performed easily on organic members such asacrylic resin which forms the organic bank layer 112 b and polyimideresin by emitting a fluorocarbon in plasma state. There is a feature inthat the fluorine member can be formed more easily on these organicmembers by performing the O₂ plasma process. Such a feature isparticularly effective in the present embodiment.

Here, the surface 111 a of the pixel electrode 111 and the first layersection 112 e of the inorganic bank layer 112 a are influenced by theCF₄ plasma process. However, the wettability will not be influenced. InFIG. 9; an area which exhibits lyophilic properties is indicated by aone-dot broken line.

(2)-4 Cooling Process

In a cooling process, the base body 2 which is heated in the plasmaprocess is cooled to an operational temperature by using the coolingprocessing chamber 54. This process is performed so as to cool the basebody 2 to an operational temperature employed in an ink jet process(functional layer forming process) which is performed later.

The cooling processing chamber 54 has a plate for disposing the basebody 2. In the plate, a water cooling device is built therein so as tocool the base body 2.

Also, by cooling the base body after the plasma process at roomtemperature of a predetermined temperature (for example, an operationaltemperature in which the ink jet process is performed), the temperaturein the base body 2 becomes constant in the next process such as thepositive hole implantation/transportation forming process; thus, it ispossible to perform a next process without temperature fluctuation ofthe base board 2. By arranging the cooling process, it is possible toform a member which is injected from an injecting device according toink jet method or the like uniformly.

For example, when a first composition including a member for forming apositive hole implantation/transportation is injected, it is possible toinject the first composition in an uniform volume continuously; thus, itis possible to form the positive hole implantation/transportation layeruniformly.

In the above plasma process, the O₂ plasma process and the CF₄ plasmaprocess are performed to the organic bank layer 112 b and the inorganicbank layer 112 a both of which are made from different memberconsequently, it is possible to dispose a lyophilic area and awater-repellant area on the bank section 112 easily.

Here, a plasma process device which is used in the plasma process is notlimited to a device shown in FIG. 6. For example, a plasma processingdevice 60 which is shown in FIG. 10 can be used.

A plasma processing device 60 shown in FIG. 10 is formed by apreliminary heating processing chamber 61, a first plasma processingchamber 62, a second plasma processing chamber 63, a cooling processingchamber 64, and a handling device 65 for transporting the base body 2 tothese chambers 61 to 64. These chambers 61 to 64 are disposed on bothsides (both sides of an arrow in the drawing) of the handling device 65.

Similarly to a case of the plasma processing device 50 shown in FIG. 6,in the plasma processing device 60, the base body 2 which is transportedfrom the bank section forming process is transported to the preliminaryheating processing chamber 61, the first plasma processing chamber 62,the second plasma processing chamber 63, and the cooling processingchamber 64 consequently so as to perform the same processes as theprocesses explained above. After that, the base body 2 is transported tonext process such as positive hole implantation/transportation layerforming process.

Also, for an above plasma processing device, a device which works undervacuum conditions can be used instead of a device which works underatmospheric pressure conditions.

(3) Positive Hole Implantation/Transportation Layer Forming Process(Functional Layer Forming Process)

Next, a positive hole implantation/transportation layer is formed on anelectrode (here, pixel electrode 111) in an illuminating layer formingprocess.

In the positive hole implantation/transportation layer forming process,a first composition (composition) including a positive holeimplantation/transportation layer forming member on the surface 111 a ofthe pixel electrode by using a liquid drop injecting device such as anink jet device. After that, a dry process and a thermal process areperformed so as to form a positive hole implantation/transportationlayer 110 a on the pixel electrode 111 and the inorganic bank layer 112a. Here, the inorganic bank layer 112 a on which the positive holeimplantation/transportation layer 110 a is formed is called the firstlayer section 112 e.

Processes thereafter including the positive holeimplantation/transportation layer forming process should preferably beconducted in an atmosphere without water and oxygen. For example, anatmosphere under a nitrogen atmosphere or argon atmosphere ispreferable.

Here, there is a case in which the positive holeimplantation/transportation layer 110 a is not formed on the first layersection 112 e. That is, there is a case in which the positive holeimplantation/transportation layer is formed only on the pixel electrode111.

Manufacturing method according to the ink jet method is as follows.

For an example of an ink jet head which is preferably used in amanufacturing method for a display device according to the presentembodiment, a head H shown in FIG. 11 can be proposed. As shown in FIG.11, the head H is formed mainly by a plurality of ink jet heads H1 and asupporting base board H7 for supporting these ink jet heads H1.

Furthermore, the base body and the head H should preferably be disposedas shown in FIG. 12.

In the ink jet device shown in FIG. 12, reference numeral 1115 indicatesa stage for mounting a base body 2 thereon. Reference numeral 1116indicates a guide rail for guiding the stage 1115 in a X axis direction(main scanning direction) in the drawing. Also, the head H can move in ay axis direction (sub-scanning direction) via the supporting member 1111by using the guide rail 1113. Furthermore, the head H can rotate in a θaxis direction so as to incline the ink jet head Hi in a predeterminedangle to the main scanning direction.

In the base body 2 shown in FIG. 12, a plurality of chips are disposedon a mother base board. That is, an area for one chip is equivalent toone display device. Here, three display areas 2 a are formed, although,the present invention is not limited in such a disposition. For example,when the composition is applied to the display area 2 a which isdisposed in a left-hand area of the base body 2 in the drawing, the headH is moved to a left-hand area in the drawing via the guide rail 1113.Simultaneously, the base body 2 is moved to an upper direction in thedrawing via the guide rail 1116. During that period, the composition isapplied while the base body 2 is scanned. Next, the base body 2 is movedin a right-hand direction in the drawing so as to apply the compositionon the display area 2 a in a center of the base body. Similarly to theabove case, the composition is applied to the display area 2 a which isdisposed in a right-hand area in the drawing.

Here, the head H shown in FIG. 12 and the ink jet device shown in FIG.15 can be used not only in the positive hole implantation/transportationlayer forming process but also to the illuminating layer formingprocess.

FIG. 13 is a perspective view of the ink jet head H1 viewed from near anarea for injecting the ink. As shown in FIG. 13, a plurality of nozzlesn1 are disposed in an array having intervals in a width direction of thehead in a longitudinal direction of the head on an ink injecting surface(facing surface toward the base body) of the ink jet head H1. Two arraysof nozzle array N2 is formed by disposing a plurality of nozzles H2 inan array. 180 pieces of nozzle n1 are included in one nozzle array n2;thus, 360 pieces of nozzle are formed in one ink jet head H1. Also,diameter of hole in the nozzle n1 is, for example, 28 μm. Pitch betweenthe nozzles n1 is, for example, 141 μm.

The ink jet head H1 has an internal structure shown in, for example,FIGS. 14A and 14B. More specifically, the ink jet head H1 has, forexample, a nozzle plate 229 made of a stainless steel, a vibrating board231 which faces the nozzle plate 229, and a separating member 232 forseparating the nozzle plate 229 and the vibrating board 231. A pluralityof composition chamber 233 and a liquid retaining chamber 234 are formedbetween the nozzle plate 229 and the vibrating board 231 by theseparating member 232. A plurality of the composition chamber 233 andthe liquid retaining chamber 234 are communicating each other via thepath 238.

A composition supplying hole 236 is formed in and adequate position onthe vibrating board 231. A composition supplying device 237 is connectedto the composition supplying hole 236. The composition supplying device237 supplies the first composition including the positive holeimplantation/transportation layer forming member to the compositionsupplying hole 236. The supplied first composition is filled in theliquid retaining chamber 234. The supplied first composition istransmitted through the path 238 so as to be filled in the compositionchamber 233.

A nozzle n1 is disposed in the nozzle plate 229 so as to inject thefirst composition under jet condition from the composition chamber 233.Also, a composition compressing member 239 is attached on a back surfaceof a surface on which the composition chamber 233 of the vibrating board231 is formed so as to correspond to the composition chamber 233. Thecomposition compressing member 239 has a piezoelectric element 241 and apair of electrode 242 a and 242 b for sandwiching the piezoelectricelement 241 as shown in FIG. 14B. The piezoelectric element 241 isdeformed by an electric current flow to the electrodes 242 a and 242 bso as to protrude to the outside which is indicated by an arrow C in thedrawing; thus, the volume of the composition chamber 233 increases.Consequently, the first composition having an equivalent volume of suchincrease passes through the path 238 from the liquid retaining chamber234 so as to flow in the composition chamber 233.

Next, when the electric current flow to the piezoelectric element 241 isturned off, the shape of the piezoelectric element 241 and the vibratingboard 23 1 recover to an initial form. By doing this, the shape of thecomposition chamber 233 recovers to the initial form. Therefore, thepressure in the first composition which is disposed inside of thecomposition chamber 233 increases; thus, the first composition isinjected as a liquid drop 110 c from the nozzle n1 toward the base body2.

FIG. 15 shows an ink jet head H1 which is scanned to the base body 2. Asshown in FIG. 15, the ink jet head H1 injects the first compositionwhile moving relatively in a direction along the X axis direction in thedrawing. During that period, a disposition direction Z of the nozzlearray n2 is inclined to the main-scanning direction (direction along theX axis direction). The nozzle array n2 in the ink jet head H1 isdisposed in an inclined position a condition to the main scanningdirection. By doing this, it is possible to dispose the nozzle pitch soas to correspond to pitches in the pixel area A. Also, it is possible tocorrespond to various pitches in the pixel area A by adjusting theinclination angle.

As shown in FIG. 16, the first composition including the positive holeimplantation/transportation layer forming member is injected from aplurality of nozzles n1 which are formed in the ink jet head H1. Here,the first composition is replenished in each pixel area A by scanningthe ink jet head H1. Such an operation can be performed by scanning thebase body 2. Furthermore, the first composition can be replenished bymoving the ink jet head Hi and the base body 2 relatively. Here, in theprocesses using the ink jet head hereafter are performed in the samemanner as the above explanation.

An injection operation is performed by the ink jet head as follows. Thatis, an injection nozzle H2 which is formed in the ink jet head H1 isdisposed so as to face the electrode surface 111 a and the firstcomposition is injected from the nozzle H2. A bank 112 which separatesthe opening section 112 g is formed around the pixel electrode 111.

The ink jet head H1 disposed so as to face the opening section 112 g.The a first composition drop 110 c of which amount per one drop iscontrolled is injected into the opening section 112 g shown in FIG. 3from the injection nozzle H2 by moving the ink jet head H1 and the basebody 2 relatively. The liquid drops which are injected into an openingsection 112 g can be six drops to 20 drops. Such a range depends on anarea of the pixel; thus it is acceptable if the liquid drops are out ofthe above range.

Here, as shown in FIGS. 16 and 17A, it is necessary that an initialliquid drop 110 c 1 which is injected to an opening section 112 g beinjected so as to contact the wall surface 112 h which is inclining inthe organic bank layer 112 b. The wall surface 112 h in the organic banklayer 112 b is processed to be water-repellant in the previouswater-repellant process; therefore, the injected liquid drop 110 c 1contacts the wall surface 112 h and is repelled there immediately. Theliquid drop 110 c 1 is transported on the wall surface 112 h so as to bedropped on the first layer section 112 e. The first layer section 112 eis processed to be lyophilic; therefore, it is acceptable if the droppedinitial liquid drop 110 c 1 spreads on the first layer section 112 e.Here, it is acceptable if the initial liquid drop 110 c 1 contacts atleast a part of the wall surface 112 h in the organic bank layer 112 b.Also, it is acceptable that the initial liquid drop 110 c 1 be injectedso as to contact the wall surface 112 h and the upper surface 112 f onthe organic bank layer 112 f simultaneously.

Consequently, liquid drops 110 c 2 which are injected after the liquiddrop 110 c 1 are injected by an interval so as not to overlap theprevious liquid drop 110 c 1 as shown in FIG. 17B. That is, it ispreferable that an interval D for dropping the liquid drops 110 c 1 and110 c 2 be larger than a diameter d of the liquid drops (D>d). Here, inthis case, the liquid drops which can be injected in one scanningoperation is limited. Therefore, it is preferable that the ink jet headH1 scans one pixel area A plural times so as to form a positive holeimplantation/transportation layer having sufficient thickness.

Furthermore, it is preferable that the injection operation is performedby using other nozzle n1 instead of a particular nozzle n1 by slightlyshifting the ink jet head H1 in a sub-scanning direction which isorthogonal to the main scanning direction when the scanning operation bythe ink jet head H1 is performed plural times each time. Thus, it ispossible to realize an effect of error diffusion in which an error inthe liquid drop amount diffuses in the nozzle by performing theinjection operation by a plural nozzle to a pixel area A. Therefore, itis possible to form a positive hole implantation/transportation layer ina uniform thickness.

Also, as shown in FIG. 17C, it is acceptable that the liquid drops 110 c2 be injected in an interval in which the liquid drop 110 c 2 overlapsthe initial liquid drop 110 c 1 after the initial liquid drops areinjected. That is, it is acceptable that the interval D between theinitial liquid drop 110 c 1 and the liquid drop 110 c 2 is narrower thena diameter d of each liquid drop (D<d). Here, in this case, the liquiddrops which can be injected in one scanning operation are not limited;therefore, it is acceptable if the scanning operation by the ink jethead HI to a pixel area A is performed once or plural times for forminga positive hole implantation/transportation layer having sufficientthickness. In a case in which the scanning operation by the ink jet headH1 is performed plural times, it is preferable that the ink jet head H1be shifted in the sub-scanning direction each time of the scanningoperation similarly to the previous case and the injection operation beperformed by using other nozzle n1 instead of a particular nozzle n1. Inthe case in which the injection operation is performed to a pixel area Aby using a plurality of nozzles, it is possible to form the positivehole implantation/transportation layer on each pixel area A in a uniformthickness because of the error diffusion effect similarly to the abovecase.

In particular, in a case in which the scanning operation by the ink jethead H1 to a pixel area A is performed twice, it is acceptable that afirst scanning direction and a second scanning direction be opposite.Also, it is acceptable that a first scanning direction and a secondscanning direction be the same.

In a case in which a first scanning direction and a second scanningdirection are opposite, it is acceptable that the first composition beinjected in half an area in the pixel area A in the first scanningoperation and the first composition is injected in the rest of the areain the second scanning operation. Also, it is possible to perform thesecond scanning operation so as to cover the area which is formed in thefirst scanning operation.

Furthermore, in a case in which a first scanning direction and a secondscanning direction are the same, it is acceptable that the injectionoperation be performed in the first scanning operation so as to have aninterval in which the liquid drops do not overlap each other and theinjection operation is performed in the second scanning operation so asto cover a space made in the previous injection operation. Certainly, itis possible to perform an injection operation so as to separate a pixelarea into two areas.

For the first composition which is used here, for example, a compositionwhich is made by solving a mixture of polythiophene derivative such aspolyethylene dioxythiophene (PEDOT) and polystyrene sulfonic acid (PSS)in a polar solvent can be used. For a polar solvent, for example,isopropyl alcohol (IPA), n-butanol, γ-butyrolactone, N-methylpyrrolidone(NMP), 1,3-dimethyl-2-imidazolidinone (DMI) and its derivative, glycolesters such as arbitol acetate, and butylcarbitol acetate can be named.

For more specific structure of the first composition, conditions such asPEDOT/PSS mixture (PEDOT/PSS=1:20): 12.52 weight %, PSS:1.44 weight %,IPA:10 weight %, NMP:27.48 weight %, DMI: 50 weight % can be proposed.Here, the viscousity of the first composition should preferably benearly 2 to 20 Ps, in particular, 4 to 15 cPs.

By using the above first composition, it is possible to perform aninjection operation stably without clogging the injection nozzle H2.

Here, a common member for a positive hole implantation/transportationlayer forming member can be used for forming illuminating layers 110 b 1to 110 b 3 for red (R), green (G), and blue (B). Also, a differentmember for a positive hole implantation/transportation layer formingmember can be used.

As shown in FIG. 16, the liquid drop 110 c of the injected firstcomposition spreads on the electrode surface 111 a to which a lyophilicprocess is performed and the first layer section 112 e finally so as tobe replenished in the lower opening section 112 c and the upper openingsection 112 d. If the liquid drop 110 c of the first composition isinjected on the upper surface 112 f which is outside of thepredetermined injection position, the first composition drop 110 c doesnot spread on the upper surface 112 f, the repelled first compositiondrop 110 c is transported into the lower opening section 112 c and theupper opening section 112 d.

Total amount of the first composition which is injected on the electrodesurface 111 a is determined by factors such as size of the lower openingsection 112 c, a size of the upper opening section 112 d, the thicknessof the positive hole implantation/transportation layer, and the densityof the positive hole implantation/transportation layer in the firstcomposition, or the like.

Next, a drying process is performed as shown in FIG. 18. In the dryingprocess, the injected first composition is dried, a polar solvent whichis included in the first composition is evaporated; thus, the positivehole implantation/transportation layer 110 a is formed.

In the drying process, the polar solvent which is included in thecomposition drop 110 c is evaporated near the inorganic bank layer 112 aand the organic bank layer 112 b. Together with the evaporation of thepolar solvent, the positive hole implantation/transportation layer iscondensed and extracted.

By doing this, a periphery section 110 a 2 made from the positive holeimplantation/transportation layer is formed on the first layer section112 e as shown in FIG. 18. The periphery section 110 a is attached onthe wall surface (organic bank layer 112 b) in the upper opening section112 d closely. The thickness of the periphery section 110 a 2 is thinnear the electrode surface 111 a and thick near the organic bank layer112 b farther from the electrode surface 111 a.

Also, simultaneously, the polar solvent is evaporated on the electrodesurface 111 a in the drying process. By doing this, a flat section 110 a1 made from the positive hole implantation/transportation layer formingmember is formed on the electrode surface 111 a. Evaporation speed ofthe polar solvent is approximately uniform on the electrode surface 111a. Therefore, the positive hole implantation/transportation layer 1forming member is condensed on the electrode surface 111 a uniformly. Bydoing this, a flat section 110 a having uniform thickness is formed.

In this way, the positive hole implantation/transportation layer 110 amade from the periphery section 110 a 2 and the flat section 110 a 1 isformed.

Here, it is acceptable that the positive holeimplantation/transportation layer be formed not on the periphery section110 a 2 but only on the electrode surface 111 a.

The above drying process is performed under condition of, for example,nitrogen atmosphere under pressure of 133.3 Pa (1 Torr) in the roomtemperature. If the pressure is too low, it is not preferable becausethe first composition drop is boiled. If the temperature is higher thanthe room temperature, the evaporation speed of the polar solventincreases; thus, it is not possible to form a flat layer.

After the drying process, it is preferable that the polar solvent and awater which remain in the positive hole implantation/transportationlayer 110 a are eliminated by heating the positive holeimplantation/transportation layer 110 a in the nitrogen atmosphere orunder vacuum condition in 200° C. for nearly ten minutes.

In the above positive hole implantation/transportation layer formingprocess, the injected first composition drop 110 c is replenished in thelower opening section 112 c and the upper opening section 112 d. On theother hand, the first composition is repelled in the organic bank layer112 b to which the water-repellant process is performed so as to betransported in the lower opening section 112 c and the upper openingsection 112 b. by doing this, it is possible to replenish the injectedfirst composition drop 110 c in the lower opening section 112 c and theupper opening section 112 d; thus, it is possible to form the positivehole implantation/transportation layer 110 a on the electrode surface111 a.

In the above positive hole implantation/transportation layer formingprocess, the first composition drop 110 c 1 which is injected initiallyfor each pixel electrode A contacts the wall surface 112 h in theorganic bank layer 112 b. Therefore, the liquid drop is transported tothe first layer section 112 e and the pixel electrode surface 111 a fromthe wall surface 112 h; thus, it is possible to spread the firstcomposition drop 110 c around the pixel electrode 111 preferentially soas to apply the first composition uniformly. By doing this, it ispossible to form the positive hole implantation/transportation layer 110a having approximately uniform thickness.

(4) Illuminating Layer Forming Process

Next, an illuminating layer forming process comprises surface refiningprocess, illuminating layer forming member injecting process, and dryingprocess.

First, the surface refining process is performed so as to refine asurface of the positive hole implantation/transportation layer 110 a.This process is explained later. Next, a second composition is injectedon the positive hole implantation/transportation layer 110 a by ink jetmethod similarly to the case of the above positive holeimplantation/transportation layer forming process. After that, theinjected second composition is dried (thermally processed) so as to forman illuminating layer 110 b on the positive holeimplantation/transportation layer 110 a.

In the illuminating layer forming process, a non-polar solvent which isnot soluble in the positive hole implantation/transportation layer 110 ais used for the second composition which is used for forming theilluminating layer so as to prevent the positive holeimplantation/transportation layer 110 a from being melted again.

However, on the other hand, lyophilic characteristics in the positivehole implantation/transportation layer 110 a to the non-polar solvent islow. Therefore, there is a concern that the positive holeimplantation/transportation layer 110 a and the illuminating layer 110 bdo not contact closely even if the second composition including thenon-polar solvent is injected on the positive holeimplantation/transportation layer 110 a or the illuminating layer 110 bcannot be applied uniformly.

Accordingly, it is preferable to perform the surface refining processbefore forming the illuminating layer so as to enhance the lyophiliccharacteristics in a surface of the positive holeimplantation/transportation layer 110 a against the non-polar solventand the illuminating layer forming member.

Here, the surface refining process is explained.

In the surface refining process, the non-polar solvent for the firstcomposition which is used in the illuminating layer forming process anda surface refining member which is a solvent equivalent or the same asthe above non-polar solvent are applied on the positive holeimplantation/transportation layer 110 a by ink jet method (liquid dropinjecting method), spin coat method, or dipping method, and dryingoperation is performed.

In the ink jet method, as shown in FIG. 19, the surface refining memberis replenished in the ink jet head H3. The surface refining member isinjected from the injection nozzle H4 which is formed in the ink jethead H3. The injection nozzle H4 is disposed so as to face the base body2 (a base body 2 in which the positive hole implantation/transportationlayer 110 a is formed) similarly to a case of the above positive holeimplantation/transportation layer forming process. While moving the inkjet head H3 and the base body 2 relatively, the surface refining member110 d is injected from the injection nozzle H4 on the positive holeimplantation/transportation layer 110 a.

In the spin coat method, the base body 2 is mounted on, for example, arotating stage and the surface refining member is dropped on the basebody 2 from above. After that, the base body 2 is rotated so as tospread the surface refining member on an entire surface fo the positivehole implantation/transportation layer 110 a on the base body 2. Here,the surface refining member spreads on the upper surface 112 f to whichthe lyophilic process is performed temporarily. However, the surfacerefining member is repelled due to a centrifugal force; thus, thesurface refining member is applied only on the positive holeimplantation/transportation layer 110 a.

Furthermore, in the dipping method, the base body 2 is soaked in, forexample, the surface refining member and raised so as to spread thesurface refining member on the positive hole implantation/transportationlayer 110 a entirely. In this case, the surface refining member alsotemporarily spreads on the lyophilically processed upper surface 112 f.However, the surface refining member is repelled from the upper surface112 f when the base body 2 is raised; thus, the surface refining memberis applied only on the positive hole implantation/transportation layer110 a.

For a surface refining member which is the same as the non-polar solventfor the second composition to be used here, cyclohexylbenzene,dihydrobenzofuran, trimethylbenzene, tetramethylbenzene can be named.For a surface refining member which is equivalent to the non-polarsolvent for the second composition, for example, toluene and xylene canbe named.

In particular, in the ink jet method, it is preferable to usedihydrobenzofuran, trimethylbenzene, tetramethylbenzene,cyclohexylbenzene, and a mixture of the above member, in particularly asolvent mixture which is the same as the second composition.

In the spin coat method or the dipping method, toluene, xylene and thelike are preferable.

Next, as shown in FIG. 20, an application area is dried. In a dryingprocess in the ink jet method, the base body 2 is mounted on a hot plateso as to be heated in, for example, 200° C. or lower so as to dry anddehydrate. In a spin coat method or the dipping method, it is preferablethat nitrogen be blown to the base body, or the base body is rotated soas to generate an air flow on a surface of the base body 2 so as to dryand dehydrate it.

Here, it is acceptable that the surface refining member be applied afterthe drying operation in the positive hole implantation/transportationlayer forming process and a heating process in the positive holeimplantation/transportation layer forming process is performed afterdrying the surface refining member which is applied thereon.

By performing such surface refining process, the surface of the positivehole implantation/transportation layer 110 a becomes lyophilic to thenon-polar solvent; thus, it is possible to apply the second compositionwhich includes the illuminating layer forming member on the positivehole implantation/transportation layer 110 a uniformly in the latterprocess.

Here, it is acceptable that the compound 2 which is generally used for apositive hole transporting member be dissolved in the above surfacerefining member so as to make a composition. The composition is appliedon the positive hole implantation/transportation layer by ink jet methodand dried; thus, the positive hole extremely thin transporting layer maybe formed on the positive hole implantation/transportation layer.

Approximately the entire part of the positive holeimplantation/transportation layer is soluble in the illuminating layer110 b which is applied in the latter process. However, a part of thepositive hole implantation/transportation layer remains between thepositive hole implantation/transportation layer 110 a and theilluminating layer 110 b in a thin layer form. By doing this, it ispossible to reduce an energy barrier between the positive holeimplantation/transportation layer 110 a and the illuminating layer 110b; thus, the positive hole can move easily. Therefore, it is possible toenhance the illuminating efficiency.

Next, in the illuminating layer forming process, the second compositionwhich includes the illuminating layer forming member is injected on thepositive hole implantation/transportation layer 110 a by ink jet method(liquid drop injecting method). After that, drying operation isperformed so as to form the illuminating layer 110 b on the positivehole implantation/transportation layer 110 a.

FIG. 21 is a general view for showing injection method by using an inkjet. As shown in FIG. 21, the ink jet head H5 and the base body 2 aremoved relatively. The second composition,which includes the illuminatinglayer forming members for each color (for example, blue (B)) is injectedfrom the injection nozzle H6 which is formed in the ink jet head.

In the injection operation, the injection nozzle is disposed so as toface the positive hole implantation/transportation layers 110 a whichare disposed in the lower opening section 112 c and the upper openingsection 112 d. The second composition is injected while the ink jet headH5 and the base body 2 are moved relatively. The amount per one time ofthe liquid injection from the injection nozzle H6 is controlled.

In this way, the amount of the liquid (second composition liquid 110 e)which is injected from the injection head. Thus, the second compositionliquid 110 e is injected on the positive holeimplantation/transportation layer 110 a.

In the illuminating layer forming process, the initial liquid drop isinjected so as to contact the bank section 112 similarly to a case ofthe positive hole implantation/transportation layer forming process. Itis acceptable that a second liquid drop is injected so as to overlap theinitial liquid drop. Also, it is acceptable that a second liquid drop isinjected so as to have an interval to the initial liquid drop.Furthermore, it is acceptable that the scanning operation be separatedinto two operations per one pixel area.

That is, similarly to a case shown in FIGS. 16 and 17A, the initialliquid drop of the second composition is injected toward an openingsection 112 g so as to contact the inclined wall surface 112 h in theorganic bank layer 112 b. The wall surface 112 h in the organic banklayer 112 b is processed to be water-repellant in the water-repellantprocess; therefore, the injected liquid drop contacts the wall surface112 h and is repelled there immediately so as to be transported on thewall surface 112 h and drops on the positive holeimplantation/transportation layer 110 a. The positive holeimplantation/transportation layer 110 a is processed to be lyophilicwith the non-polar solvent in the surface refining process; therefore,the liquid drop which is transported and dropped there spreads on thepositive hole implantation/transportation layer 110 a. Here, it isacceptable that the initial liquid drop contact at at least a part ofthe wall surface 112 h in the organic bank layer 112 b. Also, theinitial liquid drop may be injected so as to contact the upper surface112 f and the wall surface 112 h in the organic bank layersimultaneously.

Consequently, the liquid drops which are injected later than the secondliquid drops are injected so as not to overlap the previous liquid dropssimilarly to a case shown in FIG. 17B. That is, it is preferable that aninterval D between the dropping liquid drops be larger than a diameterin each liquid drop (D>d). Here, in this case, the liquid drop which isinjected is limited in one scanning operation; therefore, it ispreferable that the scanning operation for on pixel area A by the inkjet head H5 be performed plural times so as to form an illuminatinglayer 112 b having sufficient thickness.

Furthermore, when the scanning operation is performed plural times bythe ink jet head H5, the ink jet head H5 is slightly shifted in asub-scanning direction orthogonal to the main scanning direction in eachscanning operation. It is preferable that the injection operation isperformed by using other nozzle instead of a particular nozzle. In thisway, the injection operation is performed by using a plurality ofnozzles to one pixel area A; thus, an error diffusion effect in which anerror which is original in the liquid drop amount diffuses can berealized; thus, it is possible to form the illuminating layer 112 b in auniform thickness.

Also, as shown in FIG. 17C, it is acceptable that the liquid drops afterthe initial liquid drops are injected in an interval in which the liquiddrop overlaps the initial liquid drop. That is, it is acceptable thatthe interval D between the initial liquid drop and the liquid drop isnarrower then a diameter d of each liquid drop (D<d). Here, in thiscase, the liquid drops which can be injected in one scanning operationare not limited; therefore, it is acceptable if the scanning operationby the ink jet head H5 on a pixel area A is performed once or pluraltimes for forming an illuminating layer 112 b having sufficientthickness. In a case in which the scanning operation by the ink jet headH5 is performed plural times, it is preferable that the ink jet head H5is shifted in the sub-scanning direction each time of the scanningoperation similarly to the previous case and the injection operation isperformed by using other nozzle instead of a particular nozzle. In acase in which the injection operation is performed to a pixel area A byusing a plurality of nozzles, it is possible to form the illuminatinglayer 112 b on each pixel area A in a uniform thickness because of theerror diffusion effect similarly to the above case.

In particular, in a case in which the scanning operation by the ink jethead H5 to a pixel area A is performed twice, it is acceptable that afirst scanning direction and a second scanning direction be opposite.Also, it is acceptable that a first scanning direction and a secondscanning direction be the same.

In a case in which a first scanning direction and a second scanningdirection are opposite, it is acceptable that the first composition beinjected in half an area in the pixel area A in the first scanningoperation and the first composition be injected in the rest of the areain the second scanning operation. Also, it is possible to perform thesecond scanning operation so as to cover the area which is formed in thefirst scanning operation.

Furthermore, in a case in which a first scanning direction and a secondscanning direction are the same, it is acceptable that the injectionoperation is performed in the first scanning operation so as to have aninterval in which the liquid drops do not overlap each other and theinjection operation is performed in the second scanning operation so asto cover a space made in the previous injection operation. Certainly, itis possible to perform an injection operation so as to separate a pixelarea into two areas.

For an illuminating layer forming member, polyfluorene derivatives shownin the above compounds 1 to 5, (poly-)p-phenylene vinylene derivative,polyphenylene derivative, polyvinyl carbazole, polythiophene derivative,perylene dye, coumarin dye, rhodamine dye can be used. Also an organicEL member can be doped to the above polymers to be used for anilluminating layer forming member. For example, rubrene, perylene,9,10-diphenylanthracene, tetraphenylbutadiene, Nile red, coumarin 6,quinacridone can be doped to the above polymers.

A non-polar solvent should preferably not be soluble in the positivehole implantation/transportation layer 110 a. For example,cyclohexylbenzene, dihydrobenzofuran, trimethylbenzene,tetramethylbenzene, can be used.

By using such non-polar solvent for the second composition in theilluminating layer 110 b, it is possible to apply the second compositionwithout re-melting the positive hole implantation/transportation layer110 a.

As shown in FIG. 21, the injected second composition 110 e spreads onthe positive hole implantation/transportation layer 110 a and isreplenished in the lower opening section 112 c and the upper openingsection 112 d. On the other hand, even if the first composition drop 110e is injected on the water-repellant upper surface I 12 f off thepredetermined injection position, the upper surface 112 f does notbecome wet by the second composition drop 110 e; thus, the secondcomposition drop 110 e is transported in the lower opening section 112 cand the upper opening section 112 d.

The amount of the second composition which is injected on the positivehole implantation/transportation layer 110 a depends on factors such asthe size of the lower opening section 112 c, the size of the upperopening section 112 d, the thickness of the illuminating layer 110 bwhich is intended to be formed, and the density of the illuminatinglayer in the second composition, and the like.

Also, it is acceptable that the second composition 110 e is injected onthe same positive hole implantation/transportation layer 110 a not onlyonce but also in plural times. In this case, the amount of the secondcomposition in each time of the injection can be the same. It is alsoacceptable that the liquid amount of the second composition change ineach injection. Furthermore, it is acceptable that the secondcomposition be disposed and injected not only in the same position onthe positive hole implantation/transportation layer 111 a but also indifferent positions in the positive hole implantation/transportationlayer 110 a in each time of the injection operation.

Next, the second composition is injected on the predetermined position,and after that, the injected second composition drop 110 e is processedto be dried. By doing this, the illuminating layer 110 b 3 is formed.That is, by performing the drying operation, the non-polar solvent whichis included in the second composition evaporates and a blue (B)illuminating layer 110 b 3 is formed as shown in FIG. 22. Here, in FIG.22, only one illuminating layer which illuminates in blue is shown. Asshown in FIG. 1 or in other drawings, illuminating elements are formedin a matrix essentially; thus, it is should be understood that numerousilluminating layers which are not shown in the drawing (corresponding toblue) are formed.

Consequently, as shown in FIG. 23, a red (R) illuminating layer 110 b 1is formed in the same process as in the case of the above blue (B)illuminating layer 110 b 3. A green (G) illuminating layer 110 b 2 isformed last.

Here, the order for forming the illuminating layers is not limited tothe above order. It is possible to form it in any forming order. Forexample, it is possible to determine the forming order according to theilluminating layer forming member.

For a drying condition for the second composition in the illuminatinglayer, for example, a condition such as 133.3 Pa (1 Torr) pressure withroom temperature in a nitrogen atmosphere for 5 to 10 minutes can beproposed. If the pressure is too low, the second composition boils;thus, it is not preferable. Also, if the temperature is higher than roomtemperature, the evaporating speed in the non-polar solvent increasesand numerous illuminating layers forming a member adhere to the wallsurface in the upper opening section 112 d; thus, it is not preferable.

Also, the green illuminating layer 110 b 2 and the red illuminatinglayer 110 b 2 have many ingredients for the illuminating layer formingmember; thus, it is preferable to dry briefly. For example, it ispreferable to perform nitrogen blowing operation for 5 to 10 minutes at40° C.

For other drying conditions, it is possible to propose to use farinfrared radiation methods, high temperature nitrogen gas blowingmethods, and the like.

In this way, the positive hole implantation/transportation layer 110 aand the illuminating layers 110 b are formed on the pixel electrode 111.

(5) Facing Electrode (Cathode) Forming Process

Next, in the facing electrode forming process, as shown in FIG. 24, acathode 12 (facing electrode) is formed on an entire surface of theilluminating layers 110 b and the organic bank layer 112 b. Here, it isacceptable that the cathode 12 is formed by layering a plurality ofmembers. For example, it is preferable that a member having a small workfunction be formed near the illuminating layers. For example, it ispossible to use Ca, Ba, and the like. Also, there is a case in which anLiF and the like is formed thereunderneath thinly. Also, it is possiblefor a member having a higher work function such as Al to be usedthereabove (sealing area) than that thereunderneath.

These cathodes 12 should preferably be formed by, for example, vacuumevaporation method, sputtering method, and CVD method and the like. Inparticular, it is preferable to form them by a vacuum evaporation methodso as to prevent damages in the illuminating layers 110 b due to heat.

Also, it is acceptable that the lithium fluoride be formed only on theilluminating layers 110 b. Furthermore, it is possible to form thelithium fluoride so as to correspond to the predetermined color. Forexample it is acceptable to form the lithium fluoride only on the blue(B) illuminating layer 110 b 3. In this case, an upper cathode layer 12made from calcium contacts the red (R) illuminating layer 110 b 1 andthe green (G) illuminating layer 110 b 2.

Also, it is preferable to use an Al layer or Ag layer of the like formedby vacuum evaporation method, sputtering method, CVD method and the likefor an upper section of the cathode 12. Also, the thickness of the uppersection of the cathode should preferably be in a range of nearly 100 to1000 nm, in particular, nearly 200 to 500 nm. Also, it is acceptable todispose a protecting layer such as SiO₂, SiN, or the like on the cathode12 for preventing oxidization.

(6) Sealing Process

Finally, in a sealing process, the base body 2 on which the illuminatingelement is formed and a sealing base board 3 b are sealed by a sealingresin 3 a. For example, the seaing resin 3 a made from athermally-curable resin or an ultraviolet-ray-curable resin is appliedon an entire surface of the base body 2. The sealing base board 3 b islayered on the sealing resin 3 a. In this process, the sealing section 3is formed on the base body 2.

The sealing process should preferably be performed in an inert gasatmosphere such as nitrogen gas, argon gas, and helium gas. If thesealing process is performed in an atmosphere, a water and an oxygeninvade in the cathode 12 if a defect such as a pin hole is formed on thecathode 12; thus, there is a concern that the cathode 12 will beoxidized. Therefore, this is not preferable.

Furthermore, the cathode 12 is connected to a wiring 5 a on the baseboard 5 shown in FIGS. 2A to 2C as examples. Also, a wiring in a circuitelement section 14 is connected to a driving IC 6. By doing this, adisplay device 1 according to the present embodiment is obtained.

Second Embodiment

Next, an example of an electronic apparatus having a display deviceaccording to the above first embodiment is explained.

FIG. 25A is a perspective view showing an example of a mobile phone. InFIG. 25A, reference numeral 600 indicates a mobile phone unit. Referencenumeral 601 indicates a display section using the above display device.

FIG. 25B is a perspective view showing an example for a mobileinformation processing device such as a word-processor and a personalcomputer. In FIG. 25B, reference numeral 700 indicates an informationprocessing device. Reference numeral 701 indicates an input section suchas a key-board. Reference numeral 3 indicates an information processingdevice unit. Reference numeral 702 indicates a display section using theabove display device.

FIG. 25 c is a perspective view showing an example for a watchelectronic apparatus. In FIG. 25C, reference numeral 800 indicates awatch unit. Reference numeral 801 indicates a display section using theabove display device.

Electronic apparatuses shown in FIGS. 25A to 25C are provided with adisplay section which has a display device according to the above firstembodiment; thus, these electronic apparatuses have a feature of thedisplay device according to the above first embodiment. Therefore, theseelectronic apparatuses have high brightness and superior displayquality.

These electronic apparatuses are manufactured by forming a displaydevice 1 having a driving IC 6 (driving circuit) shown in FIGS. 2A and2B similarly to a case of the above first embodiment and by assemblingthe display device 1 in a mobile phone, a mobile information processingdevice, and a watch electronic apparatus.

The invention is described below, with reference to detailedillustrative embodiments. It will be apparent that the invention can beembodied in a wide variety of forms, some of which may be quitedifferent from those of the disclosed embodiments. Consequently, thespecific structural and functional details disclosed herein are merelyrepresentative and do not limit the scope of the invention.

FIG. 26 is a cross section of a display device as another exampleaccording to the present invention. A display device shown in FIG. 26comprises a base body 2, a display element 10 which is formed on thebase body 2, a sealing resin 603 which is applied around the base bodyin circular manner, and a sealing section 3 which is provided on thedisplay element 10.

The base body 2 and the display element 10 are the same as the base body2 and the display element 10 according to the above first embodiment.The display element 10 comprises mainly an illuminating element section11 and a cathode 12 which is formed on the illuminating element section11.

Also, as shown in FIG. 26, a sealing section 3 is provided on theilluminating element section 11. The sealing section 3 is formed by asealing resin made from a thermally-curable-resin or anultraviolet-ray-curable resin applied on the cathode 12 and a sealingbase board 3 b which is disposed on the sealing resin 3 a. Here, it ispreferable to use the sealing resin 3 a which does not generate a gas orsolvent during a hardening period.

The sealing section 3 is formed so as to cover at least approximatelythe entire cathode 12 which is disposed on the illuminating elementsection 11. By doing this, the sealing section 3 prevents a water or anoxygen from invading a functional layer including the cathode 12 and theilluminating layer so as to prevent the cathode 12 and the illuminatinglayer from being oxidized.

Here, the sealing base board 3 b is attached to the sealing resin 3 a soas to protect the sealing resin 3 a. It is preferable that the sealingbase board 3 b be a glass member or a metal member.

Also, FIG. 27 is a cross section of a display device as other exampleaccording to the present invention. The display device shown in FIG. 27comprises a base body 2, a display element 10 which is formed on thebase body 2, a sealing resin 3 a which is applied on an entire surfaceof the display element 10, and a sealing base board 3 b which isprovided on the sealing resin 3 a.

The base body 2, the display element 10, the sealing resin 3 a, and asealing base board 3 b are the same as the base body 2, the displayelement 10, the sealing resin 3 a, and a sealing base board 3 baccording to the first embodiment.

Also, as shown in FIG. 27, a protecting layer 714 is formed between thesealing member 3 and the cathode 12. The protecting layer 714 is madefrom SiO₂, SiN, or the like having thickness of 100 to 200 nm. Theprotecting layer 714 prevents water or oxygen from invading the cathode12 and the functional layer including the illuminating layer; thus, theoxidization in the cathode 12 and the illuminating layer is prevented.

According to the above display device, the invasion of water and oxygencan be effectively prevented; thus, the oxidization in the cathode 12 orthe illuminating layer can be prevented. By doing this, it is possibleto realize higher brightness and longer product life in the displaydevice.

Also, in the first embodiment, a case in which illuminating layers 110 bsuch as R, B, and G are disposed in a stripe is explained. However, thepresent invention is not limited to such a disposition. In the presentinvention, it is possible to adapt various disposition structures. Forexample, in addition to the stripe disposition shown in FIG. 28A, it ispossible to adapt mosaic disposition shown in FIG. 28B or a deltadisposition shown in FIG. 28C

INDUSTRIAL APPLICABILITY

As explained in detail above, according to manufacturing method for adisplay device in the present invention, a liquid drop of the abovecomposition which is initially injected for each functional layercontacts at least a part of the above bank section. By doing this, theliquid drop is transported on the electrode surface from the banksection. Thus, it is possible to spread the liquid drop of thecomposition around the electrode preferentially; therefore, it ispossible to apply the composition uniformly. By doing this, it ispossible to form the functional layer in a uniform thickness.

1-7. (canceled)
 8. A method for manufacturing a display device using amanufacturing device, the display device having a base body, a pluralityof electrodes formed on the base body, and a plurality of bank sectionsformed around the electrodes, the manufacturing device having aplurality of nozzles for ejecting first and second liquid dropscorresponding to types of compounds for forming at least an activelayer, the method comprising: imparting liquid-affinity andliquid-repellency to the bank sections; ejecting the first liquid dropsonto the electrodes so that the ejected first liquid drops make contactwith a part of the bank sections; and ejecting the second liquid dropsso that the ejected second liquid drops make contact with a part of thepreviously-ejected first liquid drops.
 9. The method according to claim8, wherein the first liquid drops make contact with liquid-repellencysections of the bank sections.
 10. The method according to claim 8,wherein the second liquid drops contact the liquid-affinity sections ofthe bank sections.
 11. The method according to claim 9, furthercomprising: forming the bank sections so as to include first banksections having liquid-affinity and second bank sections havingliquid-repellency; and disposing the first bank sections so as tooverlap a part of the electrodes.
 12. A method for manufacturing adisplay device using a manufacturing device, the display device having abase body, a plurality of electrodes formed on the base body, and aplurality of bank sections formed around the electrodes, themanufacturing device having a plurality of nozzles for ejecting firstand second liquid drops corresponding to types of compounds for formingat least an active layer, the method comprising: forming the banksections so that the bank sections overlap a part of the electrodes;imparting liquid-affinity to a part of the electrodes; impartingliquid-repellency to at least a part of the bank sections; forming atleast the active layer on the electrodes by ejecting the liquid drops onthe electrodes; and forming counter electrodes on the active layer,wherein, the forming of the active layer comprises: ejecting the firstliquid drops onto the electrodes so that the ejected first liquid dropsmake contact with a part of the bank sections; and ejecting the secondliquid drops so that the ejected second liquid drops make contact with apart of the previously-ejected first liquid drops.
 13. The methodaccording to claim 12 wherein the bank sections include first banklayers having liquid-affinity and second bank layers havingliquid-repellency, the first bank layers overlapping a part of theelectrodes.
 14. The method according to claim 13 wherein the activelayer serves as at least a hole injection/transport layer.
 15. Themethod according to claim 14 wherein the active layer serves as at leastan illuminating layer.
 16. The method according to claim 8, whereinnozzle arrays, formed by the nozzles, scan the base body and eject theliquid drops, the nozzle arrays being inclined with respect to ascanning direction of the nozzle arrays.
 17. The method according toclaim 16, wherein the active layer is formed by ejecting the liquiddrops at least twice so that intervals between the ejected liquid dropsare narrower than a diameter of the ejected liquid drop.
 18. The methodaccording to claim 17, wherein the active layer is formed by a scanningmovement of the nozzle arrays once.
 19. A method for manufacturing adisplay device using a manufacturing device, the display device having abase body, a plurality of electrodes formed on the base body, and aplurality of bank sections formed around the electrodes, themanufacturing device having a plurality of nozzles for ejecting first tothird liquid drops corresponding to types of compounds for forming atleast an active layer, the method comprising: imparting liquid-affinityand liquid-repellency to the bank sections; forming the active layer byejecting the liquid drops at least twice; ejecting the first liquiddrops onto the electrodes so that the ejected first liquid drops makecontact with a part of the bank sections; ejecting the second liquiddrops so that the ejected second liquid drops make contact with a partof the previously-ejected first liquid drops, intervals between thefirst liquid drops and the second liquid drops are greater than adiameter of the first liquid drops, or greater than a diameter of thesecond liquid drops; and disposing the third liquid drops so that theejected third liquid drops cover intervals between the first liquiddrops and the second liquid drops.
 20. The method according to claim 17,wherein the active layer is formed by the scanning movement of thenozzle arrays at least twice.
 21. The method according to claim 17,wherein the active layer is formed by the scanning movement of thenozzle arrays while changing the nozzles corresponding to the type ofactive layer.
 22. The method according to claim 21, wherein the scanningmovement of the nozzle arrays is shifted in a sub-scanning directionwhile changing the nozzles corresponding to the type of active layer.23. The display device manufactured by the method according to claim 8.24. A method for manufacturing an electronic apparatus, using amanufacturing device, the electronic apparatus having a display deviceand a driving circuit for driving the display device, the display devicehaving a base body, a plurality of electrodes formed on the base body,and a plurality of bank sections formed around the electrodes, themanufacturing device having a plurality of nozzles for ejecting firstand second liquid drops corresponding to types of compounds for formingat least an active layer, the method comprising: impartingliquid-affinity and liquid-repellency to the bank sections; ejecting thefirst liquid drops onto the electrodes so that the ejected first liquiddrops make contact with at least a part of the bank sections; andejecting the second liquid drops so that the ejected second liquid dropsmake contact with a part of the previously-ejected first liquid drops.25. The method according to claim 24 wherein the ejected liquid dropsmake contact with regions having the liquid-repellency.
 26. The methodaccording to claim 24 wherein the ejected liquid drops make contact withregions having the liquid-affinity.
 27. The method according to claim25, further comprising: forming the bank sections so that the banksections have first bank sections having liquid-affinity and second banksections having liquid-repellency; and disposing the first bank sectionsso as to overlap a part of the electrodes.
 28. A method formanufacturing a display device and an electronic apparatus, using amanufacturing device, the display device having a base body, a pluralityof electrodes formed on the base body, and a plurality of bank sectionsformed around the electrodes, the electronic apparatus having thedisplay device and driving circuits for driving thereof, themanufacturing device having a plurality of nozzles for ejecting firstand second liquid drops corresponding to types of compounds for formingat least an active layer, the method comprising: forming the banksections so that the bank sections overlap a part of the electrodes;imparting liquid-affinity to at least the part of the electrodes;imparting liquid-repellency to the part of the bank sections; forming atleast the active layer on the electrodes by ejecting the liquid drops onthe electrodes; and forming counter electrodes on the active layer,wherein, the forming of the active layer comprises: ejecting the firstliquid drops onto the electrodes so that the ejected first liquid dropsmake contact with at least a part of the bank sections; and ejecting thesecond liquid drops so that the ejected second liquid drops make contactwith a part of the previously-ejected first liquid drops.
 29. The methodaccording to claim 28, further comprising: forming the bank sections sothat the bank sections include first bank sections havingliquid-affinity and second bank sections having liquid-repellency; anddisposing the first bank sections so as to overlap the part of theelectrodes.
 30. The method according to claim 24, wherein the activelayer serves as at least a hole injection/transport layer.
 31. Themethod according to claim 24, wherein the active layer serves as atleast an illuminating layer.
 32. The method according to claim 24,wherein nozzle arrays, formed by the nozzles, scan the base body andeject the liquid drops, the nozzle arrays being inclined with respect toa scanning direction of the nozzle arrays.
 33. The method according toclaim 24, wherein the active layer is formed by ejecting the liquiddrops at least twice so that intervals between the ejected liquid dropsare narrower than a diameter of the ejected liquid drop.
 34. The methodaccording to claim 33, wherein the active layers are formed by thescanning movement of the nozzle arrays once.
 35. A method formanufacturing an electronic apparatus, using a manufacturing device, theelectronic apparatus having a display device and a driving circuit fordriving the display device, the display device having a base body, aplurality of electrodes formed on the base body, and a plurality of banksections formed around the electrodes, the manufacturing device having aplurality of nozzles for ejecting first to third liquid dropscorresponding to types of compounds for forming at least an activelayer, the method comprising: imparting liquid-affinity andliquid-repellency to the bank sections; forming the active layer byejecting the liquid drops at least twice; ejecting the first liquiddrops onto the electrodes so that the ejected first liquid drops makecontact with a part of the bank sections; ejecting the second liquiddrops so that the ejected second liquid drops make contact with a partof the previously-ejected first liquid drops, intervals between thefirst liquid drops and the second liquid drops are greater than adiameter of the first liquid drops, or greater than a diameter of thesecond liquid drops; and ejecting the third liquid drops so that theejected third liquid drops cover intervals between the first liquiddrops and the second liquid drops.
 36. The method according to claim 35,wherein the active layers are formed by the scanning of the nozzlearrays at least twice.
 37. The method according to claim 33, wherein theactive layers are formed by the scanning movement of the nozzle arrayswhile changing the nozzles corresponding to the type of active layer.38. The method according to claim 37, wherein the scanning movement ofthe nozzle arrays is shifted in a sub-scanning direction while changingthe nozzles corresponding to the type of active layer.
 39. Theelectronic apparatus manufactured by the method according to claim 24.